Molded chip scale package for high pin count

A unique molded Chip Scale Package (CSP) associated 1024 pin counts has been developed. The design and process have been optimized in order to achieve high mount density, enhanced electrical characteristic and cost competitiveness. Also, the reliability testing was performed on thermal cycling and m...

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Bibliographic Details
Main Authors: Baba, S., Tomita, Y., Matsuo, M., Matsushima, H., Ueda, N., Nakagawa, O.
Format: Conference Proceeding
Language:English
Subjects:
Chip scale packaging
Conductivity
Cost function
Design optimization
Electric variables
Moisture
Performance evaluation
Process design
Testing
Thermal resistance
Online Access:Request full text
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Description
Summary:A unique molded Chip Scale Package (CSP) associated 1024 pin counts has been developed. The design and process have been optimized in order to achieve high mount density, enhanced electrical characteristic and cost competitiveness. Also, the reliability testing was performed on thermal cycling and moisture induced crack resistivity. Finally, enhanced electrical and thermal characteristics were calculated.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1996.550895