Molded chip scale package for high pin count

A unique molded Chip Scale Package (CSP) associated 1024 pin counts has been developed. The design and process have been optimized in order to achieve high mount density, enhanced electrical characteristic and cost competitiveness. Also, the reliability testing was performed on thermal cycling and m...

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Main Authors: Baba, S., Tomita, Y., Matsuo, M., Matsushima, H., Ueda, N., Nakagawa, O.
Format: Conference Proceeding
Language:English
Subjects:
Chip scale packaging
Conductivity
Cost function
Design optimization
Electric variables
Moisture
Performance evaluation
Process design
Testing
Thermal resistance
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creator Baba, S.
Tomita, Y.
Matsuo, M.
Matsushima, H.
Ueda, N.
Nakagawa, O.
description A unique molded Chip Scale Package (CSP) associated 1024 pin counts has been developed. The design and process have been optimized in order to achieve high mount density, enhanced electrical characteristic and cost competitiveness. Also, the reliability testing was performed on thermal cycling and moisture induced crack resistivity. Finally, enhanced electrical and thermal characteristics were calculated.
doi_str_mv 10.1109/ECTC.1996.550895
format conference_proceeding
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identifier ISSN: 0569-5503
ispartof 1996 Proceedings 46th Electronic Components and Technology Conference, 1996, p.1251-1257
issn 0569-5503
2377-5726
language eng
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source IEEE Xplore All Conference Series
subjects Chip scale packaging
Conductivity
Cost function
Design optimization
Electric variables
Moisture
Performance evaluation
Process design
Testing
Thermal resistance
title Molded chip scale package for high pin count
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