Integral heat sink analysis for two-terminal microwave oscillator devices

A theoretical analysis to calculate the maximum temperature within integral heat sink packages, for two-terminal microwave oscillator devices, is outlined. Results, useful for design purposes, are presented that show how the maximum temperature rise depends on the input heat flux and the dimensions...

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Bibliographic Details
Published in:Microelectronics 1996-09, Vol.27 (6), p.499-503
Main Authors: Batchelor, A.R., Postoyalko, V.
Format: Article
Language:English
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Summary:A theoretical analysis to calculate the maximum temperature within integral heat sink packages, for two-terminal microwave oscillator devices, is outlined. Results, useful for design purposes, are presented that show how the maximum temperature rise depends on the input heat flux and the dimensions and thermal conductivity of the heat sink materials.
ISSN:1879-2391
0026-2692
1879-2391
DOI:10.1016/0026-2692(95)00111-5