Step coverage of tungsten films deposited by germane reduction of WF sub(6)

The step coverage of tungsten films deposited by the germane reduction of WF sub(6) is investigated. The step coverage modulus for the germane process is influenced only by the deposition temperature. It hardly depends on the partial pressures of the reactive species. These results are confirmed by...

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Bibliographic Details
Published in:Applied surface science 1993-01, Vol.73, p.64-70
Main Authors: Oosterlaken, T G M, eusink, G J, Janssen, GCAM, Radelaar, S
Format: Article
Language:English
Online Access:Get full text
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Summary:The step coverage of tungsten films deposited by the germane reduction of WF sub(6) is investigated. The step coverage modulus for the germane process is influenced only by the deposition temperature. It hardly depends on the partial pressures of the reactive species. These results are confirmed by experiments on structures with a large internal surface as compared to the access area. The step coverage of the films deposited by this process is excellent and sufficient to fill small (0.5 mu m) contact holes with a high aspect ratio.
ISSN:0169-4332