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Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors

This paper presents systematic investigations of electrical and stability properties of various low temperature co-fired ceramics (LTCC) resistors. One of the goals of this work was to check the compatibility of LTCC materials (tapes, resistive and conductive inks) from various manufacturers. Three...

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Bibliographic Details
Published in:Microelectronics and reliability 2001-05, Vol.41 (5), p.669-676
Main Authors: Dziedzic, Andrzej, Golonka, Leszek J, Kita, Jaroslaw, Thust, Heiko, Drue, Karl-Heinz, Bauer, Reinhard, Rebenklau, Lars, Wolter, Klaus-Jurgen
Format: Article
Language:English
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Summary:This paper presents systematic investigations of electrical and stability properties of various low temperature co-fired ceramics (LTCC) resistors. One of the goals of this work was to check the compatibility of LTCC materials (tapes, resistive and conductive inks) from various manufacturers. Three commercially available green tapes and three LTCC resistor/conductor systems were examined. The resistive inks with 1 k Omega /sq. nominal sheet resistance were used. Buried (inside) and surface resistors were laminated and fired according to the tape manufacturers' recommendations. The influence of dimensional effect on sheet resistance and hot temperature coefficient of resistance, the temperature dependence of resistance in a wide temperature range (from -180 degree C to +130 degree C), long-term stability of thermally aged as-fired resistors (150 degree C, 500 h) and durability to high-voltage micro- or nanosecond pulses (50 ns pulses with 4000 V/mm maximum electric field or 10 mu s ones with 700-1000 V/mm electrical field) were carried out for electrical and stability characterisation of LTCC resistors. Non-destructive scanning acoustic microscope diagnostics was applied for structure investigation and estimation of lamination and cofiring process quality of buried LTCC resistors. copyright 2001 Elsevier Science Ltd.
ISSN:0026-2714
DOI:10.1016/S0026-2714(01)00004-X