Room temperature tensile properties of Sn-5%Sb solder

Research and development efforts are underway towards the development of lead-free solder alloys and results of research into the room temperature tensile properties of Sn-5% Sb solder have been reported. Compared to the popular Pb-Sn eutectic, its melting point is high, as is its contact angle from...

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Bibliographic Details
Published in:Journal of materials science letters 1994-01, Vol.13 (19), p.1387-1389
Main Authors: MAHIDHARA, R. K, SASTRY, S. M. L, JERINA, K. L, TURLIK, I, MURTY, K. L
Format: Article
Language:English
Subjects:
Applied sciences
Elasticity. Plasticity
Exact sciences and technology
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
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Summary:Research and development efforts are underway towards the development of lead-free solder alloys and results of research into the room temperature tensile properties of Sn-5% Sb solder have been reported. Compared to the popular Pb-Sn eutectic, its melting point is high, as is its contact angle from which its wettability is assessed. Tests performed to study the room temperature deformation and fracture characteristics of a fine-grained Sn-5% Sb solder have been conducted in air. Metallography involved optical and scanning electron microscopy. Examination of the failed solder showed that, irrespective of the strain rate, Sn-5% Sb failed intergranularly. A maximum ductility of 350% was obtained under ambient conditions.
ISSN:0261-8028
1573-4811
DOI:10.1007/BF00405039