Hardening of an AgPdMg alloy and its interdiffusion with BiSrCaCuO compounds

It is shown that the hardness of the AgPdMg alloy after an anneal of only 1.5 h at 840 C in air, is of the order of 6 times that of pure Ag. However, evidence indicates that a severe interaction occurs between the alloy and Bi compounds due to diffusion of Pd into the superconducting layer during th...

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Bibliographic Details
Published in:Journal of materials science letters 1997-09, Vol.16 (17), p.1469-1471
Main Authors: SCHMIRGELD-MIGNOT, L, HOUZET, J, POISSONNET, S, LEGENDRE, F, REGNIER, P
Format: Article
Language:English
Subjects:
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties
Physics
Superconducting device characterization, design, and modeling
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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Summary:It is shown that the hardness of the AgPdMg alloy after an anneal of only 1.5 h at 840 C in air, is of the order of 6 times that of pure Ag. However, evidence indicates that a severe interaction occurs between the alloy and Bi compounds due to diffusion of Pd into the superconducting layer during the partial melt growth processing of Bi-2212. 10 refs.
ISSN:0261-8028
DOI:10.1023/A:1018598302856