Processing of 3D interconnected porous aluminum nitride composites for electronic packaging

A simple process was used to fabricate 3D interconnected porous aluminum nitride composites. For this purpose aluminum powders were cold pressed and sintered under controlled conditions of temperature and time to initiate particle necking and coarsening, but with minimum shrinkage. The resultant com...

Full description

Saved in:
Bibliographic Details
Published in:Materials letters 1994-11, Vol.21 (3), p.329-333
Main Authors: Kumta, Prashant N., Mah, Tai-il, Jero, Paul D., Kerans, Ronald J.
Format: Article
Language:English
Subjects:
Applied sciences
Building materials. Ceramics. Glasses
Ceramic industries
Chemical industry and chemicals
Electrotechnical and electronic ceramics
Exact sciences and technology
Technical ceramics
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A simple process was used to fabricate 3D interconnected porous aluminum nitride composites. For this purpose aluminum powders were cold pressed and sintered under controlled conditions of temperature and time to initiate particle necking and coarsening, but with minimum shrinkage. The resultant compacts were characterized for their microstructure and density using optical microscopy and pycnometry measurements. The sintered compacts contain ≈ 28% porosity comprising of 5–75 μm pores which are well connected and continuous to the surface. The pores were then infiltrated with borosilicate glass to a depth of ≈ 30–80 μm. Such composites would potentially exhibit optimum dielectric and thermal conductivity values making them viable substrate materials for electronic packaging.
ISSN:0167-577X
1873-4979
DOI:10.1016/0167-577X(94)90199-6