Bismaleimide resin modified with diallyl bisphenol A and diallyl p-phenyl diamine for resin transfer molding

O,O′‐diallyl bisphenol A (DBA) and N,N′‐diallyl p‐phenyl diamine (DPD) were used for the reactive diluents of 4,4′‐bismaleimidodiphenol methane (BDM). The objective was to obtain a modified BDM resin system suitable for resin transfer molding (RTM) process to prepare the advanced composites. The pro...

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Bibliographic Details
Published in:Journal of applied polymer science 2001-06, Vol.80 (12), p.2245-2250
Main Authors: Li, Zhongming, Yang, Mingbo, Huang, Rui, Zhang, Meidong, Feng, Jianmin
Format: Article
Language:English
Subjects:
Applied sciences
bismaleimidodiphenol methane
Chemical properties
diallyl bisphenol A
diallyl p-phenyl diamine
Exact sciences and technology
Organic polymers
Physicochemistry of polymers
Polycondensation
Polymer industry, paints, wood
Preparation, kinetics, thermodynamics, mechanism and catalysts
Properties and testing
reactive diluents
resin transfer molding
Technology of polymers
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Summary:O,O′‐diallyl bisphenol A (DBA) and N,N′‐diallyl p‐phenyl diamine (DPD) were used for the reactive diluents of 4,4′‐bismaleimidodiphenol methane (BDM). The objective was to obtain a modified BDM resin system suitable for resin transfer molding (RTM) process to prepare the advanced composites. The processing behavior was determined by time–temperature–viscosity curves, gel characteristics, and differential scanning calorimetry (DSC). The injection temperature of the resin system in RTM could be 80°C, at which its apparent viscosity was only 0.31 Pa/s, and the apparent viscosity was still less than 1.00 Pa/s after the resin was held at 80°C for 16 h. The gel time test result indicated that at low temperatures, the reactivity of the resin system is low, whereas at high temperatures, the resin could cure very fast, which was beneficial to RTM. The postcure of the cured resin at a given temperature was necessary because the resin had a wide and flat cure exothermic peak, observed by DSC curve. The cured resin displayed both high heat and hot/wet resistance and high mechanical properties, especially tensile strength, tensile modulus, and flexural strength at room temperature, which reached 96.2 MPa, 4.8 GPa, and 121.4 MPa, respectively. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2245–2250, 2001
ISSN:0021-8995
1097-4628
DOI:10.1002/app.1328