Mechanical properties of thin film–substrate systems

This paper is devoted to a study of the mechanical properties of thin film–substrate systems using indentation methods. The magnitude of the load used for indentation, the properties of the system thin film–substrate and the thickness of the thin film, determine the type of material properties which...

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Published in:Journal of materials processing technology 2003-02, Vol.133 (1-2), p.189-194
Main Authors: Simunkova, S, Blahova, O, Stepanek, I
Format: Article
Language:English
Subjects:
Adhesive behavior
Microhardness
Nanoindentor
Scratch test
Thin film
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description This paper is devoted to a study of the mechanical properties of thin film–substrate systems using indentation methods. The magnitude of the load used for indentation, the properties of the system thin film–substrate and the thickness of the thin film, determine the type of material properties which can be analyzed such as microhardness (nanohardness), adhesive and cohesive behavior, fracture properties and wear resistance. Nanoindentor Shimadzu DUH2, scratch tester CSEM Revetest and common hardness tester Ernst were used for the investigation of mechanical properties. Useful indentation methods and the magnitudes of the load are discussed for each mechanical property.
doi_str_mv 10.1016/S0924-0136(02)00231-5
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subjects Adhesive behavior
Microhardness
Nanoindentor
Scratch test
Thin film
title Mechanical properties of thin film–substrate systems
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