Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads

As various small electronics components are being rapidly moved along an assembly line, their leads must be cut and clinched into holes of a circuit board for the next soldering operation. This process must be achieved economically both in time, and in combating wear by preserving the cutting tools’...

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Bibliographic Details
Published in:Journal of manufacturing science and engineering 1998-05, Vol.120 (2), p.279-286
Main Authors: Engel, P. A, Wu, Kee Rong, Zhai, Xuejun, Janisiewicz, Stan
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:As various small electronics components are being rapidly moved along an assembly line, their leads must be cut and clinched into holes of a circuit board for the next soldering operation. This process must be achieved economically both in time, and in combating wear by preserving the cutting tools’ sharpness. The present study investigates the shearing action and subsequent fracture in cutting. Plastic analysis for both cutting and forming (clinching) is presented with the support of measured data obtained on a prototype machine employed in the research. Wear analysis of the cutting surfaces leads to a recognition of the role played by various geometric parameters such as lead shape, cutter and anvil angles, cutter and anvil distance, etc.
ISSN:1087-1357
1528-8935
DOI:10.1115/1.2830125