Correlation between intermetallic thickness and roughness during solder reflow

The evolution of Cu−Sn and Ni−Sn intermetallic compound (IM) morphologies during isochronal reflow of a PbSn solder with Cu and electroless-Ni was investigated. The root mean square roughness of the Cu−Sn and Ni−Sn IM layers exhibited a linear dependence on average thickness, with gradients () of 0....

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Bibliographic Details
Published in:Journal of electronic materials 2001-08, Vol.30 (8), p.997-1000
Main Authors: ZURUZI, A. S, LAHIRI, S. K, BURMAN, P, SIOW, K. S
Format: Article
Language:English
Subjects:
Applied sciences
Copper
Electronics
Evolution
Exact sciences and technology
Intermetallic compounds
Metallization, contacts, interconnects
device isolation
Metals. Metallurgy
Microelectronic fabrication (materials and surfaces technology)
Morphology
Nickel compounds
Roughness
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solders
Thickness
Tin
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Summary:The evolution of Cu−Sn and Ni−Sn intermetallic compound (IM) morphologies during isochronal reflow of a PbSn solder with Cu and electroless-Ni was investigated. The root mean square roughness of the Cu−Sn and Ni−Sn IM layers exhibited a linear dependence on average thickness, with gradients () of 0.33 and 0.65, respectively. The difference in values was attributed to different thickness distributions resulting from morphological dissimilarity of the IM layers. The apparent activation energies for growth and roughness evolution of both IM were found to be similar and suggest that both IM thickness and roughness evolution are controlled by the same mechanism.
ISSN:0361-5235
1543-186X
DOI:10.1007/BF02657724