Nanomechanical fracture-testing of thin films

Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These techniques utilized micron-scale diamond tips with instrumentation continuously measuring to sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial...

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Bibliographic Details
Published in:Engineering fracture mechanics 1998-08, Vol.61 (1), p.1-20
Main Authors: Kriese, M.D., Boismier, D.A., Moody, N.R., Gerberich, W.W.
Format: Article
Language:English
Subjects:
indentation
interfacial fracture
nanomechanics
scratch testing
thin films
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Summary:Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These techniques utilized micron-scale diamond tips with instrumentation continuously measuring to sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial crack propagation problem, utilizing linear elastic fracture mechanics and characterized by the critical strain energy release rate. A 9.1 μm thick phenol–formaldehyde polymer film on stainless steel was tested with indentation, scratching and edge-loading of fine lines. Also, sputtered copper and tungsten–copper bilayer films on SiO 2, 150 to 1500 nm thick, were tested with indentation.
ISSN:0013-7944
1873-7315
DOI:10.1016/S0013-7944(98)00050-2