In-process detection of microscratching during CMP using acoustic emission sensing technology

An experimental investigation on the correlation between the microscratches and the signal characteristics of acoustic emission (AE) generated during chemical mechanical planarization (CMP) has been performed. CMP experimental results from both laboratory and production line CMP machines have clearl...

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Bibliographic Details
Published in:Journal of electronic materials 1998-10, Vol.27 (10), p.1099-1103
Main Authors: Tang, Jianshe, Dornfeld, David, Pangrle, Suzette Keefe, Dangca, Alvin
Format: Article
Language:English
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Summary:An experimental investigation on the correlation between the microscratches and the signal characteristics of acoustic emission (AE) generated during chemical mechanical planarization (CMP) has been performed. CMP experimental results from both laboratory and production line CMP machines have clearly showed that AE rms voltage in the time domain has distinctive features relating to scratching. The sensitivity of AE signals to the CMP process state change was also investigated. The results show that this AE sensing technology can be used as a tool for in-situ microscratch detection and process monitoring in CMP.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-998-0144-x