Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect

• Main Authors: Liu, Y.S., Wojnarowski, R.J., Hennessy, W.A., Piacente, P.A., Rowlette, J., Kadar-Kallen, M., Stack, J., Yue Liu, Peczalski, A., Nahata, A., Yardley, J.
• Format: Conference Proceeding
• Language: English
• Subjects: Backplanes; Collaboration; Optical arrays; Optical interconnections; Optical planar waveguides; Optical polymers; Optical waveguides; Planar waveguides; Plastic packaging; Vertical cavity surface emitting lasers
• ISSN: 0569-5503; 2377-5726
• DOI: 10.1109/ECTC.1998.678832

The technical approach and progress achieved under the Polymer Optical Interconnect Technology (POINT) program are described in this paper. The POINT program is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and University of California at San Diego (UCSD), sponsored by DARPA/ETO, to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. Specifically, progress is reported on (a) development of batch-operated plastic VCSEL array packaging technology using planar fabrication, (b) demonstration of high-density optical interconnects for board and backplane applications using polymer waveguides to a length of 50 cm at an I/O density of 250 channels per inch, (c) development of low-loss optical polymer waveguides with loss less than 0.1 dB/cm at 850 nm, and (d) development of passive alignment processes for efficient coupling between a VCSEL array and polymer waveguides. Significant progress has also been made under the POINT program at Columbia University, in applying CAD tools to simulate multimode-guided wave systems and, at UCSD, to assist mechanical and thermal design in optoelectronic packaging.