A model of chemical mechanical polishing

A model of chemical mechanical polishing is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2001-06, Vol.148 (6), p.G355-G358
Main Author: PAUL, Ed
Format: Article
Language:English
Subjects:
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Polishing
Surface treatments
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Summary:A model of chemical mechanical polishing is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing rate is followed by an asymptotic approach to a maximum rate. The causes and implications of this behavior are discussed.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1372222