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Stress Relaxation, Creep Recovery, and Newtonian Viscous Flow in Silicon Nitride
A new approach to tensile creep testing and analysis based on stress relaxation is described for sintered silicon nitride. Creep rate data covering up to 5 orders of magnitude are generated in tests lasting less than 1 day. Tests from various initial stresses at temperatures up to 1300°C are analyze...
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Published in: | Journal of the American Ceramic Society 1998-09, Vol.81 (9), p.2327-2332 |
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Main Author: | |
Format: | Article |
Language: | English |
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Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | A new approach to tensile creep testing and analysis based on stress relaxation is described for sintered silicon nitride. Creep rate data covering up to 5 orders of magnitude are generated in tests lasting less than 1 day. Tests from various initial stresses at temperatures up to 1300°C are analyzed and compared with creep rates measured during conventional constant load testing. It is shown that at least 40% of the creep strain accumulated under all test conditions is recoverable, and that the deformation may properly be described as viscoelastic. A regime which approximated as Newtonian viscous behavior (creep rate directly proportional to stress) was observed during decreasing stress at temperatures between 1200° and 1300°C. This resulted in anomalous behavior at low strains in pseudo stress‐strain curves generated from the stress relaxation data. However, the otherwise systematic rate dependence provides a possible basis for design in terms of a secant modulus analysis. The anelastic, recoverable component of creep may lead to complex deformation history‐dependent phenomena. |
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ISSN: | 0002-7820 1551-2916 |
DOI: | 10.1111/j.1151-2916.1998.tb02628.x |