Inductively coupled plasma application to the resist ashing

We present a study of a resist ashing using O 2 inductively coupled plasma (ICP) at low pressure (

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Bibliographic Details
Published in:Thin solid films 2001-05, Vol.386 (2), p.160-164
Main Authors: Takagi, Ken-ichi, Ikeda, Akihiro, Fujimura, Tsuyoshi, Kuroki, Yukinori
Format: Article
Language:English
Subjects:
Applied sciences
Ashing
Electronics
Exact sciences and technology
Flat band voltage
ICP
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Description
Summary:We present a study of a resist ashing using O 2 inductively coupled plasma (ICP) at low pressure (
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(00)01636-9