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Growth structure and properties of Fe rich Fe-Ni alloy films deposited on MgO(001) by d.c.-biased plasma-sputtering

Ni-Fe alloy films of about 100 nm in thickness were deposited on MgO(001) substrates at 250°C by d.c. plasma sputtering at 2.5 kV in pure Ar gas by applying a Ni 0.3Fe 0.7(Invar) or Ni 0.2Fe 0.8 target. A d.c. bias voltage V s between 0 and −180 V was applied to the substrate during deposition. The...

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Bibliographic Details
Published in:Thin solid films 1999-06, Vol.347 (1), p.85-90
Main Authors: Yang, Jiping, Barna, Arpad, Makihara, Kenji, Hashimoto, Mituru, Barna, Peter B.
Format: Article
Language:English
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Summary:Ni-Fe alloy films of about 100 nm in thickness were deposited on MgO(001) substrates at 250°C by d.c. plasma sputtering at 2.5 kV in pure Ar gas by applying a Ni 0.3Fe 0.7(Invar) or Ni 0.2Fe 0.8 target. A d.c. bias voltage V s between 0 and −180 V was applied to the substrate during deposition. The structure and composition of the films were investigated by X-ray photoelectron spectroscopy (XPS), and by cross sectional transmission electron microscopy (XTEM). The resistance, its temperature coefficient TCR (150 to 300K) and saturation magnetization 4 πMs at 300 K were measured as a function of V s. With the use of Ni 0.3Fe 0.7 target, Ni 1− x Fe x films with x between 0.68±0.03 and 0.73±0.03, can be prepared where x was weakly dependent on V s. The film is epitaxially grown mainly with FCC-NiFe(001)[010]∥MgO(001)[010] accompanied with the initial thin layer of about 5 to 10 nm in thickness with BCC-NiFe(001)[110]∥MgO(001)[100] at the interface at V s values studied. Maximum TCR and minimum resistance are observed between V s=−120 to −160 V. 4 πMs takes greater value at V s≥120 V. In the case of Ni 0.2Fe 0.8 target at V s=−120 V, Ni 1− x Fe x films with x=0.80±0.03 are entirely grown in a BCC structure with NiFe(001)[110]∥MgO(001)[100].
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(98)01731-3