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Simulation of shape evolution during electrodeposition of copper in the presence of additive

Shape evolution during electrodeposition of copper in microtrenches was studied numerically by a model which incorporates adaptive meshing capabilities. Filling of trenches with copper without creating a void was related to plating additives in solution. The shape-change behavior of this system resu...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2001, Vol.148 (1), p.C54-C58
Main Authors: GEORGIADOU, M, VEYRET, D, SANI, R. L, ALKIRE, R. C
Format: Article
Language:English
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Summary:Shape evolution during electrodeposition of copper in microtrenches was studied numerically by a model which incorporates adaptive meshing capabilities. Filling of trenches with copper without creating a void was related to plating additives in solution. The shape-change behavior of this system resulting from variation of the feature's aspect ratio, bulk composition, and level of additive components was investigated. The operating window of bath conditions for void-free electrodeposition was studied in the range of 0.25 mult 10 exp -4 to 10 exp -4 M bulk concentration of additive in a 0.25 M CuSO sub 4 + 0.2 M H sub 2 SO sub 4 plating solution and for aspect ratios (depth:width) from 0.5 to 4. The mathematical model includes fluid flow, transport by diffusion, migration and convection, multiple species, and reactions in complex geometries.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1344540