Microstructural engineering of solders

The reliability of solders, especially under service conditions, is strongly influenced by their behavior under creep, thermomechanical fatigue, creep-fatigue interactions and the effects of aging on these properties. Stabilization of the solder microstructure during service will also significantly...

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Bibliographic Details
Published in:Journal of electronic materials 1999-11, Vol.28 (11), p.1176-1183
Main Authors: Subramanian, K N, Bieler, T R, Lucas, J P
Format: Article
Language:English
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Summary:The reliability of solders, especially under service conditions, is strongly influenced by their behavior under creep, thermomechanical fatigue, creep-fatigue interactions and the effects of aging on these properties. Stabilization of the solder microstructure during service will also significantly help in reliability prediction modeling. Among the various methods used to improve reliability and microstructure stabilization, one that holds significant promise, is the incorporation of compatible reinforcements by in-situ methods. The composite solder produced by utilizing this strategy exhibits improved properties that are likely to enhance service performance.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-999-0154-3