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Atomistic study of interaction zone at copper–carbon interfaces

Formation of Cu–C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu–C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix. The high-resolution...

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Bibliographic Details
Published in:Materials Science & Engineering C 2001-08, Vol.15 (1), p.191-193
Main Authors: Dorfman, Simon, Mundim, Kleber C, Fuks, David, Berner, Alex, Ellis, Donald E, Van Humbeeck, Jan
Format: Article
Language:English
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Summary:Formation of Cu–C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu–C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix. The high-resolution scanning electron microscopy (HR SEM) study displays the formation of the interaction zone. Monte Carlo simulations with repulsive Cu–C interatomic potentials study this zone on the interface.
ISSN:0928-4931
1873-0191
DOI:10.1016/S0928-4931(01)00308-3