Wettability of electrode metals on barium titanate substrate

• Published in: Journal of materials science 2001, Vol.36 (4), p.825-829
• Main Authors: WANG, Sea-Fue, YANG, Thomas C. K, LEE, Shiao-Ching
• Format: Article
• Language: English
• Subjects: Aluminum oxide; Barium titanates; Bonding strength; Condensed matter: structure, mechanical and thermal properties; Contact angle; Contact pressure; Copper; Dielectric strength; Electrodes; Exact sciences and technology; Gold; Lead; Materials science; Multilayers; Noble metals; Palladium; Partial pressure; Passive components; Physics; Silicon dioxide; Silver; Soldering; Solid-fluid interfaces; Substrates; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Tin; Wettability; Wetting; Zirconium dioxide
• ISSN: 0022-2461; 1573-4803
• DOI: 10.1023/a:1004862011318

The wettability and bonding strength between electrode metals and dielectrics are very important for internal electrodes, terminations, and soldering of multilayer ceramic passive components. In this work, the contact angles of electrode metals, including Pb, Sn, Au, Ag, Ag/Pd, and Cu on BaTiO3 were measured. Results showed that the addition of Pd into Ag significantly reduced the contact angle of Ag on BaTiO3 substrate. The wettability of noble metals (Ag and Au) is nearly independent of the partial pressure of oxygen, under the circumstances of the investigated oxygen partial pressure and within the accuracy of the contact angle measurement. However, molten Cu changes its contact angle drastically when using purified Ar (102°) instead of as-received Ar (89°), and in an air atmosphere (64°). The work of adhesion, according to Young-Dupré equation, was also calculated for these metals. Results were compared with those on ZrO2, SiO2 and Al2O3.