Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints

The microstructure and adhesion strength of the Sn–0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn–3.5Ag alloy, the Sn–0.7Cu solder showed comparable we...

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Bibliographic Details
Published in:Journal of materials research 2002-04, Vol.17 (4), p.743-746
Main Authors: Bae, Kyoo-Sik, Kim, Si-Jung
Format: Article
Language:English
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Summary:The microstructure and adhesion strength of the Sn–0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn–3.5Ag alloy, the Sn–0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular η-phase grew into a round and scallop-shaped morphology, thin є(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.
ISSN:0884-2914
2044-5326
DOI:10.1557/JMR.2002.0108