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WCCo cutting tool inserts with diamond coatings
WCCo cutting tool inserts were coated with diamond films using microwave plasma assisted chemical vapor deposition. Several pretreatment processes and combinations were used to enhance the diamond nucleation and growth: mechanical treatments with diamond powder seeding, acid etching of the cobalt u...
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Published in: | Diamond and related materials 1999-10, Vol.8 (10), p.1913-1918 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
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cited_by | cdi_FETCH-LOGICAL-c367t-bf92d552c877aad4b084af9e4911f5faa285e8acf59fae1b611eaa73aab8999b3 |
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cites | cdi_FETCH-LOGICAL-c367t-bf92d552c877aad4b084af9e4911f5faa285e8acf59fae1b611eaa73aab8999b3 |
container_end_page | 1918 |
container_issue | 10 |
container_start_page | 1913 |
container_title | Diamond and related materials |
container_volume | 8 |
creator | Silva, S. Mammana, V.P. Salvadori, M.C. Monteiro, O.R. Brown, I.G. |
description | WCCo cutting tool inserts were coated with diamond films using microwave plasma assisted chemical vapor deposition. Several pretreatment processes and combinations were used to enhance the diamond nucleation and growth: mechanical treatments with diamond powder seeding, acid etching of the cobalt using an electrolytic acid bath, and formation of a TiC or DLC interlayer using metal plasma immersion ion implantation and deposition (MePIIID). Scanning electron microscopy (SEM) was used to view the diamond film morphology, and microanalysis was used to examine for cobalt removal after acid etching. The diamond quality was characterized by Raman spectroscopy, and the adhesion between the film and the cutting tool inserts was estimated by indentation tests. The present work compares the different treatments of the WCCo insert surface, with particular reference to the adhesion between the diamond film and the cutting tool insert. |
doi_str_mv | 10.1016/S0925-9635(99)00156-9 |
format | article |
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Several pretreatment processes and combinations were used to enhance the diamond nucleation and growth: mechanical treatments with diamond powder seeding, acid etching of the cobalt using an electrolytic acid bath, and formation of a TiC or DLC interlayer using metal plasma immersion ion implantation and deposition (MePIIID). Scanning electron microscopy (SEM) was used to view the diamond film morphology, and microanalysis was used to examine for cobalt removal after acid etching. The diamond quality was characterized by Raman spectroscopy, and the adhesion between the film and the cutting tool inserts was estimated by indentation tests. The present work compares the different treatments of the WCCo insert surface, with particular reference to the adhesion between the diamond film and the cutting tool insert.</description><identifier>ISSN: 0925-9635</identifier><identifier>EISSN: 1879-0062</identifier><identifier>DOI: 10.1016/S0925-9635(99)00156-9</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Applied sciences ; Chemical vapor deposition ; Cutting tools ; Diamond ; Electronics ; Exact sciences and technology ; Intermediate layers ; Microelectronic fabrication (materials and surfaces technology) ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Diamond and related materials, 1999-10, Vol.8 (10), p.1913-1918</ispartof><rights>1999 Elsevier Science S.A.</rights><rights>1999 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c367t-bf92d552c877aad4b084af9e4911f5faa285e8acf59fae1b611eaa73aab8999b3</citedby><cites>FETCH-LOGICAL-c367t-bf92d552c877aad4b084af9e4911f5faa285e8acf59fae1b611eaa73aab8999b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,27905,27906</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=2006062$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Silva, S.</creatorcontrib><creatorcontrib>Mammana, V.P.</creatorcontrib><creatorcontrib>Salvadori, M.C.</creatorcontrib><creatorcontrib>Monteiro, O.R.</creatorcontrib><creatorcontrib>Brown, I.G.</creatorcontrib><title>WCCo cutting tool inserts with diamond coatings</title><title>Diamond and related materials</title><description>WCCo cutting tool inserts were coated with diamond films using microwave plasma assisted chemical vapor deposition. Several pretreatment processes and combinations were used to enhance the diamond nucleation and growth: mechanical treatments with diamond powder seeding, acid etching of the cobalt using an electrolytic acid bath, and formation of a TiC or DLC interlayer using metal plasma immersion ion implantation and deposition (MePIIID). Scanning electron microscopy (SEM) was used to view the diamond film morphology, and microanalysis was used to examine for cobalt removal after acid etching. The diamond quality was characterized by Raman spectroscopy, and the adhesion between the film and the cutting tool inserts was estimated by indentation tests. The present work compares the different treatments of the WCCo insert surface, with particular reference to the adhesion between the diamond film and the cutting tool insert.</description><subject>Applied sciences</subject><subject>Chemical vapor deposition</subject><subject>Cutting tools</subject><subject>Diamond</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Intermediate layers</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0925-9635</issn><issn>1879-0062</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNqFkM1KxDAUhYMoOI4-gtCFiC6qSdq0vSuR4h8MuFBxGW7TRCOdZkwyik_iq_hUPoOdH2br6m6-cw_nI-SQ0TNGWXH-QIGLFIpMnACcUspEkcIWGbGqhJTSgm-T0QbZJXshvA0Qh5yNCH-uf79_apeoeYy2f0mic11i-6B9DMmnja9Ja3Hq-jZRDhdE2Cc7BrugD9Z3TJ6urx7r23Ryf3NXX05SlRVlTBsDvBWCq6osEdu8oVWOBnQOjBlhEHkldIXKCDCoWVMwphHLDLGpAKDJxuR49Xfm3ftchyinNijdddhrNw-Sl5xyqLIBFCtQeReC10bOvJ2i_5KMyoUhuTQkF_MlgFwakjDkjtYFGBR2xmOvbNiE-aBukDdgFytMD2M_rPYyKKt7pVvrtYqydfafoj_MJnum</recordid><startdate>19991001</startdate><enddate>19991001</enddate><creator>Silva, S.</creator><creator>Mammana, V.P.</creator><creator>Salvadori, M.C.</creator><creator>Monteiro, O.R.</creator><creator>Brown, I.G.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>19991001</creationdate><title>WCCo cutting tool inserts with diamond coatings</title><author>Silva, S. ; Mammana, V.P. ; Salvadori, M.C. ; Monteiro, O.R. ; Brown, I.G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c367t-bf92d552c877aad4b084af9e4911f5faa285e8acf59fae1b611eaa73aab8999b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Applied sciences</topic><topic>Chemical vapor deposition</topic><topic>Cutting tools</topic><topic>Diamond</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Intermediate layers</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Silva, S.</creatorcontrib><creatorcontrib>Mammana, V.P.</creatorcontrib><creatorcontrib>Salvadori, M.C.</creatorcontrib><creatorcontrib>Monteiro, O.R.</creatorcontrib><creatorcontrib>Brown, I.G.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Diamond and related materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Silva, S.</au><au>Mammana, V.P.</au><au>Salvadori, M.C.</au><au>Monteiro, O.R.</au><au>Brown, I.G.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>WCCo cutting tool inserts with diamond coatings</atitle><jtitle>Diamond and related materials</jtitle><date>1999-10-01</date><risdate>1999</risdate><volume>8</volume><issue>10</issue><spage>1913</spage><epage>1918</epage><pages>1913-1918</pages><issn>0925-9635</issn><eissn>1879-0062</eissn><abstract>WCCo cutting tool inserts were coated with diamond films using microwave plasma assisted chemical vapor deposition. Several pretreatment processes and combinations were used to enhance the diamond nucleation and growth: mechanical treatments with diamond powder seeding, acid etching of the cobalt using an electrolytic acid bath, and formation of a TiC or DLC interlayer using metal plasma immersion ion implantation and deposition (MePIIID). Scanning electron microscopy (SEM) was used to view the diamond film morphology, and microanalysis was used to examine for cobalt removal after acid etching. The diamond quality was characterized by Raman spectroscopy, and the adhesion between the film and the cutting tool inserts was estimated by indentation tests. The present work compares the different treatments of the WCCo insert surface, with particular reference to the adhesion between the diamond film and the cutting tool insert.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/S0925-9635(99)00156-9</doi><tpages>6</tpages></addata></record> |
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source | ScienceDirect Freedom Collection |
subjects | Applied sciences Chemical vapor deposition Cutting tools Diamond Electronics Exact sciences and technology Intermediate layers Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
title | WCCo cutting tool inserts with diamond coatings |
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