Transient effects in the directional solidification of AlCu alloys

Transient acceleration effects of the solid/liquid interface during controlled directional solidification of an Al-4.5 wt% Cu alloy have been investigated by a mechanical probing technique. Samples were processed under both constant velocity and suddenly increased velocity conditions. Mechanical pro...

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Bibliographic Details
Published in:Journal of crystal growth 1997-08, Vol.179 (3), p.625-634
Main Authors: Su, Rong-Jiunn, Jemian, W.A., Overfelt, R.A.
Format: Article
Language:English
Subjects:
Applied sciences
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Growth from melts
zone melting and refining
Materials science
Metals. Metallurgy
Methods of crystal growth
physics of crystal growth
Physics
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Summary:Transient acceleration effects of the solid/liquid interface during controlled directional solidification of an Al-4.5 wt% Cu alloy have been investigated by a mechanical probing technique. Samples were processed under both constant velocity and suddenly increased velocity conditions. Mechanical probing data of the interface position versus time are given and compared with the imposed crucible velocity. The transient solidification rate of the solid/liquid interface can be described by the crucible velocity and a relaxation delay time and the experimental data have been compared with theoretical models proposed in the literature. Results showed that both the experimental solidification rate and delay time can be predicted under each experimental condition using the methodology of Saitou and Hirata.
ISSN:0022-0248
1873-5002
DOI:10.1016/S0022-0248(97)00162-0