Crack mechanism in wire bonding joints

High voltage and high current power modules are key components for traction applications. While the modules are exposed to harsh stress conditions all over their lifetime, high reliability is of decisive importance in this field of application. In power electronic packages wire bonding is used for t...

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Bibliographic Details
Published in:Microelectronics and reliability 1998-06, Vol.38 (6), p.1301-1305
Main Authors: Ramminger, S., Türkes, P., Wachutka, G.
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Testing, measurement, noise and reliability
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Summary:High voltage and high current power modules are key components for traction applications. While the modules are exposed to harsh stress conditions all over their lifetime, high reliability is of decisive importance in this field of application. In power electronic packages wire bonding is used for the electrical interconnection from the chips to the output pins. Wire bond lift-off and solder fatigue are limiting the reliability. In this work we investigate the initiation and growth of cracks in the wire bonds using finite-element analysis.
ISSN:0026-2714
1872-941X
DOI:10.1016/S0026-2714(98)00141-3