Effect of tartrate on the morphological characteristics of the copper-tin electrodeposits from a noncyanide acid bath

Copper and tin were electrodeposited on platinum substrates from a 1.0 M sulphuric acid plating bath in the presence and absence of tartrate. Voltammetric curves indicated two deposition processes, at -0.310 and -0.640 V, which do not shift upon addition of tartrate to the plating bath. The presence...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied electrochemistry 2000-08, Vol.30 (8), p.987-994
Main Authors: CARLOS, I. A, SOUZA, C. A. C, PALLONE, E. M. J. A, FRANCISCO, R. H. P, CARDOSO, V, LIMA-NETO, B. S
Format: Article
Language:English
Subjects:
Applied sciences
Chemistry
Electrochemistry
Electrodeposition
Exact sciences and technology
General and physical chemistry
Metallic coatings
Metals. Metallurgy
Production techniques
Study of interfaces
Surface treatment
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Copper and tin were electrodeposited on platinum substrates from a 1.0 M sulphuric acid plating bath in the presence and absence of tartrate. Voltammetric curves indicated two deposition processes, at -0.310 and -0.640 V, which do not shift upon addition of tartrate to the plating bath. The presence of tartrate decreased the current density in the region of the more cathodic process. The metals were electrodeposited at both deposition potentials and the deposits have the same proportions of copper and tin either with or without tartrate in the plating bath, as observed by AAS. X-ray spectra suggested that a mixture of Cu and eta -Cu sub 6 Sn sub 5 alloy was deposited at the less cathodic potential. SEM analysis showed that tartrate affects the morphology of the films.
ISSN:0021-891X
1572-8838
DOI:10.1023/A:1004047110057