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Effect of Interface Properties on Microcracking of Iron Titanate
Appropriately tailored interfaces at the grain boundaries can be used to reduce the residual stresses that are generated from thermal mismatch strains during cooling from the fabrication temperature to room temperature due to thermal expansion anisotropy. Interfaces with higher coefficient of therma...
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Published in: | Scripta materialia 1998-04, Vol.38 (9), p.1449-1453 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Appropriately tailored interfaces at the grain boundaries can be used to reduce the residual stresses that are generated from thermal mismatch strains during cooling from the fabrication temperature to room temperature due to thermal expansion anisotropy. Interfaces with higher coefficient of thermal expansion are most effective in reducing residual stresses in Fe sub 2 TiO sub 5 grains and those with lower stiffness in reducing the residual stresses in the interface. In both cases, these conditions reduce the overall propensity for spontaneous microcracking. |
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ISSN: | 1359-6462 1872-8456 |
DOI: | 10.1016/S1359-6462(98)00040-2 |