Fluxless FC-soldering in O sub(2) purged ambient

This paper describes a straightforward approach to fluxless flip-chip soldering: bonding in ambient with reduced O sub(2) partial pressure. Using as-deposited SnAg solder bumps and in-situ reflow, impressively strong self-alignment could be achieved, which resulted in a complete overlap of chip meta...

Full description

Saved in:
Bibliographic Details
Published in:Proceedings / Electronic Components Conference 1998-01
Main Authors: Kuhmann, J F, Pedersen, E H
Format: Article
Language:English
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper describes a straightforward approach to fluxless flip-chip soldering: bonding in ambient with reduced O sub(2) partial pressure. Using as-deposited SnAg solder bumps and in-situ reflow, impressively strong self-alignment could be achieved, which resulted in a complete overlap of chip metallization and solder bumps. The results of this work have been successfully transferred to reflow furnaces with N sub(2) and N sub(2)/H sub(2) purge, suitable for batch processing.
ISSN:0569-5503