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Electrical properties and annealing effects on the stress of RF-sputtered c-BN films

The c-BN films prepared by RF sputtering were annealed immediately at temperature ranging from 773 to 1373 K in air and vacuum, respectively. The thermal stability and the compressive film stress calculated from the frequency shift of cubic boron nitride (c-BN) infrared absorption peak were investig...

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Bibliographic Details
Published in:Materials letters 2000, Vol.45 (2), p.111-115
Main Authors: Zhang, X.W, Zou, Y.J, Yan, H, Wang, B, Chen, G.H, Wong, S.P
Format: Article
Language:English
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Summary:The c-BN films prepared by RF sputtering were annealed immediately at temperature ranging from 773 to 1373 K in air and vacuum, respectively. The thermal stability and the compressive film stress calculated from the frequency shift of cubic boron nitride (c-BN) infrared absorption peak were investigated. The results show that with increasing annealing temperatures the compressive film stress decreases significantly, and the adhesion of c-BN film is improved. The electrical measurements were performed for the annealed samples. The results show that the unintentionally doped c-BN films have n-type conductivity and the room temperature resistivity is in the range of 10 5–10 7 Ω cm, which is lower significantly than that of intrinsic bulk c-BN. The c-BN/p-Si heterojunction was fabricated and the I– V curve of this structure indicates typical semiconductor diode characteristics.
ISSN:0167-577X
1873-4979
DOI:10.1016/S0167-577X(00)00086-0