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Electrical properties and annealing effects on the stress of RF-sputtered c-BN films
The c-BN films prepared by RF sputtering were annealed immediately at temperature ranging from 773 to 1373 K in air and vacuum, respectively. The thermal stability and the compressive film stress calculated from the frequency shift of cubic boron nitride (c-BN) infrared absorption peak were investig...
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Published in: | Materials letters 2000, Vol.45 (2), p.111-115 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The c-BN films prepared by RF sputtering were annealed immediately at temperature ranging from 773 to 1373 K in air and vacuum, respectively. The thermal stability and the compressive film stress calculated from the frequency shift of cubic boron nitride (c-BN) infrared absorption peak were investigated. The results show that with increasing annealing temperatures the compressive film stress decreases significantly, and the adhesion of c-BN film is improved. The electrical measurements were performed for the annealed samples. The results show that the unintentionally doped c-BN films have n-type conductivity and the room temperature resistivity is in the range of 10
5–10
7 Ω cm, which is lower significantly than that of intrinsic bulk c-BN. The c-BN/p-Si heterojunction was fabricated and the
I–
V curve of this structure indicates typical semiconductor diode characteristics. |
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ISSN: | 0167-577X 1873-4979 |
DOI: | 10.1016/S0167-577X(00)00086-0 |