Ion solid surface interactions in ionized copper physical vapor deposition

A thorough understanding of ion-solid surface interactions is important for the predictive modeling of ionized metal plasma (IMP) Cu physical vapor deposition (PVD) at feature scales. Besides sticking coefficients and sputter yields, characterizations such as angular distributions of sputtered and r...

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Bibliographic Details
Published in:Thin solid films 2002-12, Vol.422 (1), p.141-149
Main Authors: Liu, X.-Y, Daw, M.S, Kress, J.D, Hanson, D.E, Arunachalam, V, Coronell, D.G, Liu, C.-L, Voter, A.F
Format: Article
Language:English
Subjects:
Applied sciences
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Copper
Cross-disciplinary physics: materials science
rheology
Electron and ion emission by liquids and solids
impact phenomena
Exact sciences and technology
Impact phenomena (including electron spectra and sputtering)
Ion and electron beam-assisted deposition
ion plating
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Molecular dynamics
Physics
Physics of gases, plasmas and electric discharges
Physics of plasmas and electric discharges
Plasma applications
Theory and models of film growth
Theory of impact phenomena
numerical simulation
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Summary:A thorough understanding of ion-solid surface interactions is important for the predictive modeling of ionized metal plasma (IMP) Cu physical vapor deposition (PVD) at feature scales. Besides sticking coefficients and sputter yields, characterizations such as angular distributions of sputtered and reflected particles, and thermal-accommodation coefficients are also needed as inputs for a feature scale process simulator. Molecular dynamic (MD) simulations have been used to provide pertinent information and physical insights. MD results for Ar +/Cu and Cu +/Cu systems as a function of hyperthermal ion energies and incidence angles are reported. The issue of integrating different sticking coefficients for different surface roughness is addressed, based on ion travel distance analysis. We have found that the angular distribution of sputtered particles is not cosine, but can be described by a simple Gaussian-like formula. Ion reflection characteristics are also analyzed.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(02)00870-2