Photoemission microscopy of the metal/metal interface: Au sub-monolayers on polycrystalline Ni

Scanning photoelectron microscopy was used to study the lateral distribution of a 0.5 monolayer (ML) of Au on a polycrystalline Ni surface after Au deposition at room temperature (RT) and following annealing at 620 K for different durations. The effect of the grain structure on the interfacial inter...

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Bibliographic Details
Published in:Applied surface science 2002-07, Vol.195 (1), p.80-88
Main Authors: Potts, A.W, Morrison, G.R, Gregoratti, L, Kiskinova, M
Format: Article
Language:English
Subjects:
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Diffusion
interface formation
Exact sciences and technology
Gold
Interface structure and roughness
Metal/metal interface
Metals. Metallurgy
Nickel
Photoelectron microscopy
Physics
Solid surfaces and solid-solid interfaces
Surface diffusion
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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Summary:Scanning photoelectron microscopy was used to study the lateral distribution of a 0.5 monolayer (ML) of Au on a polycrystalline Ni surface after Au deposition at room temperature (RT) and following annealing at 620 K for different durations. The effect of the grain structure on the interfacial interactions and Au surface mobility was examined. The Ni 3p and the Au 4f photoelectron images revealed that annealing leads to lateral heterogeneity in the Au distribution. The contributions of the two processes of surface diffusion and surface alloying are considered to explain the changes in Au surface concentrations observed on different grains after deposition and annealing.
ISSN:0169-4332
1873-5584
DOI:10.1016/S0169-4332(02)00556-1