Production mechanism and chemical structure of dust particles in fluorocarbon plasmas

Dust particles were found to be produced in octafluorocyclobutane (c-C4F8) plasmas used for reactive ion etching of silicon dioxide films and chemical vapor deposition of low dielectric constant films. The dust particles contained the ultrahigh mass polymers of 100000 in molecular weight, which were...

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Bibliographic Details
Main Authors: Takahashi, Kazuo, Ono, Kouichi, Setsuhara, Yuichi
Format: Conference Proceeding
Language:English
Online Access:Get full text
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Summary:Dust particles were found to be produced in octafluorocyclobutane (c-C4F8) plasmas used for reactive ion etching of silicon dioxide films and chemical vapor deposition of low dielectric constant films. The dust particles contained the ultrahigh mass polymers of 100000 in molecular weight, which were compounds carbon-rich compared with deposited films and were formed from gas phase products related to C2F4. The ultrahigh mass polymers could work as nuclei, and were grown to be spherical micrometer-sized dust particles. The dust particle included crystalline grain of a few nanometer scale which corresponded to the nuclei size estimated form the molecular weight. (Author)
ISSN:0094-243X