Structural characterization and properties of colloidal silica coatings on copper substrates

• Published in: Materials letters 2002-10, Vol.56 (4), p.450-453
• Main Authors: Garcı́a-Cerda, L.A, Mendoza-González, O, Pérez-Robles, J.F, González-Hernández, J
• Format: Article
• Language: English
• Subjects: Applied sciences; Colloidal silica; Copper substrate; Cross-disciplinary physics: materials science; rheology; Electrochemical impedance spectroscopy; Exact sciences and technology; Liquid phase epitaxy; deposition from liquid phases (melts, solutions, and surface layers on liquids); Materials science; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; Nonmetallic coatings; Physics; Production techniques; SiO 2 thin films; Sol–gel coatings; Surface treatment
• ISSN: 0167-577X; 1873-4979
• DOI: 10.1016/S0167-577X(02)00526-8

Colloidal silica coatings were deposited on copper substrates and their structural properties and corrosion resistance to a saline solution were studied. Optacol™ colloidal silica was used as primary reactive. Coatings were obtained by immersion and withdrawal speed was 2.1 mm/s. They were dried at 100 °C during 15 min and given a heat treatment at 180 °C for 30 min. X-ray diffraction (XRD) showed the existence on the coating of a semicrystalline cristoballite phase depending on the heat treatment temperature. X-ray-photoelectron spectroscopy (XPS) demonstrated that the formation of SiO 2 bonds is enhanced when the heat treatment temperature is increased. Electrochemical impedance spectroscopy (EIS) was used to measure the corrosion resistance of these films.