Ion-induced desorption by Ar+ ions from Al, Cu and films of Cu grown on stainless steel

• Published in: Surface and interface analysis 2003-09, Vol.35 (9), p.738-742
• Main Authors: Lozano, M. P., Hilleret, N., de Segovia, J. L.
• Format: Article
• Language: English
• Subjects: aluminium; Applied sciences; Atomic, molecular, and ion beam impact and interactions with surfaces; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; copper; Electron and ion emission by liquids and solids; impact phenomena; Exact sciences and technology; Impact phenomena (including electron spectra and sputtering); ion-induced desorption; Metals. Metallurgy; Physics; Solid surfaces and solid-solid interfaces; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)
• ISSN: 0142-2421; 1096-9918
• DOI: 10.1002/sia.1588

The ion‐induced desorption yield from pure aluminium, oxygen free high conductivity copper (OFHC) and films of copper electrodeposited on stainless steel, has been studied for unbaked samples and samples after 24 h of baking at 80, 120, 150 and 200 °C. Measurements were performed using argon ions of energy 3 keV and current density 2.5(×10−8)–10−6 A cm−2. The desorption is focused on those gases usually present in ultrahigh vacuum systems, such as H2, CO, CO2, CH4 and CxHy. The ion‐induced desorption yields are presented as a function of the ion dose to the sample surface and are discussed according to the surface material and surface treatment. The lowest ion yields of 6.5 and 6.8 molecules per ion, respectively, are obtained for Al and Cu samples after a bake‐out of the system at 200 °C. Copyright © 2003 John Wiley & Sons, Ltd.