The Year 2022 in biomaterials research: A perspective from the editors of six leading journals

• Published in: Journal of biomedical materials research. Part A 2023-09, Vol.111 (9), p.1298-1308
• Main Authors: Stegemann, Jan P., Wagner, William R., Göbel, Uta, Perets, Ekaterina, Leong, Kam W., Leach, J. Kent, Gilbert, Jeremy
• Format: Article
• Language: English
• Subjects: biofabrication; biointerfaces; Biomaterials; biomedical engineering; Biomedical materials; Fabrication; Functional materials; Gene transfer; Lipids; Metals; Microgels; nanomedicine; Polysaccharides; Saccharides; Tissue engineering; Wound healing; Wound infection
• ISSN: 1549-3296; 1552-4965
• DOI: 10.1002/jbm.a.37529

The field of biomaterials science is highly active, with a steadily increasing number of publications and new journals being founded. This article brings together contributions from the editors of six leading journals in the area of biomaterials science and engineering. Each contributor highlights specific advances, topics, and trends that have emerged through the publications in their respective journal in the calendar year 2022. It presents a global perspective on a wide range of material types, functionalities, and applications. The highlighted topics include a diversity of biomaterials; from proteins, polysaccharides, and lipids to ceramics, metals, advanced composites, and a variety of new forms of these materials. Important advances in dynamically functional materials are presented, including a range of fabrication techniques such as bioassembly, 3D bioprinting and microgel formation. Similarly, several applications are highlighted in drug and gene delivery, biological sensing, cell guidance, immunoengineering, electroconductivity, wound healing, infection resistance, tissue engineering, and treatment of cancer. The goal of this paper is to provide the reader with both a broad view of recent biomaterials research, as well as expert commentary on some of the key advances that will shape the future of biomaterials science and engineering.