Electrochemical behavior of a new solder material (Sn–In–Ag)

New solder alloys are being developed for electronic assemblies in replacement for traditional Pb-containing solder materials. New low-melting-point, Sn–In–Ag-based alloys have been investigated. Corrosion resistance and the influence of In and Ag content on the electrochemical behaviour have been s...

Full description

Saved in:
Bibliographic Details
Published in:Materials letters 2003-10, Vol.57 (28), p.4368-4371
Main Authors: Oulfajrite, H., Sabbar, A., Boulghallat, M., Jouaiti, A., Lbibb, R., Zrineh, A.
Format: Article
Language:English
Subjects:
Applied sciences
Corrosion
Corrosion mechanisms
Electrochemical behavior
Exact sciences and technology
Metals. Metallurgy
Sn–In–Ag
Solder material
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:New solder alloys are being developed for electronic assemblies in replacement for traditional Pb-containing solder materials. New low-melting-point, Sn–In–Ag-based alloys have been investigated. Corrosion resistance and the influence of In and Ag content on the electrochemical behaviour have been studied for some Sn–In–Ag special alloys in 3% NaCl solution. The good resistance of this ternary system has been confirmed, and the increase of corrosion resistance with Ag content of Sn–In–Ag alloys has been established.
ISSN:0167-577X
1873-4979
DOI:10.1016/S0167-577X(03)00326-4