Platinum plating

Electroplating solutions for the deposition of platinum are generally similar to those employed for palladium; however, whereas palladium ions in solution are almost always divalent, platinum ions exhibit stable valences of 2+ or 4+. Divalent platinum ions can become oxidized to quadrivalent at the...

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Bibliographic Details
Published in:Metal finishing 2003-01, Vol.101 (1A), p.237-237
Main Author: Morrissey, R J
Format: Article
Language:English
Online Access:Get full text
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Summary:Electroplating solutions for the deposition of platinum are generally similar to those employed for palladium; however, whereas palladium ions in solution are almost always divalent, platinum ions exhibit stable valences of 2+ or 4+. Divalent platinum ions can become oxidized to quadrivalent at the anode, particularly in alkaline solution. Such oxidation can lead to progressive, sometimes erratic, losses in current efficiency. For this reason it is often useful to separate the anode compartment in electroplating solutions of this type.
ISSN:0026-0576