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Ribbon wedge bonding. Machine configuration and tools
With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.
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| Published in: | Advanced packaging 2003-07, Vol.12 (7), p.55 |
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| Main Author: | |
| Format: | Magazinearticle |
| Language: | English |
| Online Access: | Get full text |
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| Summary: | With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire. |
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| ISSN: | 1065-0555 |