Ribbon wedge bonding. Machine configuration and tools

With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.

Saved in:
Bibliographic Details
Published in:Advanced packaging 2003-07, Vol.12 (7), p.55
Main Author: Seufert, K
Format: Magazinearticle
Language:English
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by
cites
container_end_page
container_issue 7
container_start_page 55
container_title Advanced packaging
container_volume 12
creator Seufert, K
description With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.
format magazinearticle
fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_miscellaneous_27943851</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>27943851</sourcerecordid><originalsourceid>FETCH-proquest_miscellaneous_279438513</originalsourceid><addsrcrecordid>eNpjYeA0NDAz1TUwNTXlYOAqLs4yMDAytLA052QwDcpMSsrPUyhPTUlPVQCyUjLz0vUUfBOTMzLzUhWS8_PSMtNLixJLMoGKEvNSFEry83OKeRhY0xJzilN5oTQ3g5qba4izh25BUX5haWpxSXxuZnFyak5OYl5qfmlxvJG5pYmxhamhMdEKAYwXN5A</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>magazinearticle</recordtype><pqid>27943851</pqid></control><display><type>magazinearticle</type><title>Ribbon wedge bonding. Machine configuration and tools</title><source>BSC - Ebsco (Business Source Ultimate)</source><creator>Seufert, K</creator><creatorcontrib>Seufert, K</creatorcontrib><description>With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.</description><identifier>ISSN: 1065-0555</identifier><language>eng</language><ispartof>Advanced packaging, 2003-07, Vol.12 (7), p.55</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>776,780</link.rule.ids></links><search><creatorcontrib>Seufert, K</creatorcontrib><title>Ribbon wedge bonding. Machine configuration and tools</title><title>Advanced packaging</title><description>With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.</description><issn>1065-0555</issn><fulltext>true</fulltext><rsrctype>magazinearticle</rsrctype><creationdate>2003</creationdate><recordtype>magazinearticle</recordtype><recordid>eNpjYeA0NDAz1TUwNTXlYOAqLs4yMDAytLA052QwDcpMSsrPUyhPTUlPVQCyUjLz0vUUfBOTMzLzUhWS8_PSMtNLixJLMoGKEvNSFEry83OKeRhY0xJzilN5oTQ3g5qba4izh25BUX5haWpxSXxuZnFyak5OYl5qfmlxvJG5pYmxhamhMdEKAYwXN5A</recordid><startdate>20030701</startdate><enddate>20030701</enddate><creator>Seufert, K</creator><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20030701</creationdate><title>Ribbon wedge bonding. Machine configuration and tools</title><author>Seufert, K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-proquest_miscellaneous_279438513</frbrgroupid><rsrctype>magazinearticle</rsrctype><prefilter>magazinearticle</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Seufert, K</creatorcontrib><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Advanced packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Seufert, K</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Ribbon wedge bonding. Machine configuration and tools</atitle><jtitle>Advanced packaging</jtitle><date>2003-07-01</date><risdate>2003</risdate><volume>12</volume><issue>7</issue><spage>55</spage><pages>55-</pages><issn>1065-0555</issn><abstract>With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.</abstract></addata></record>
fulltext fulltext
identifier ISSN: 1065-0555
ispartof Advanced packaging, 2003-07, Vol.12 (7), p.55
issn 1065-0555
language eng
recordid cdi_proquest_miscellaneous_27943851
source BSC - Ebsco (Business Source Ultimate)
title Ribbon wedge bonding. Machine configuration and tools
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-22T11%3A39%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Ribbon%20wedge%20bonding.%20Machine%20configuration%20and%20tools&rft.jtitle=Advanced%20packaging&rft.au=Seufert,%20K&rft.date=2003-07-01&rft.volume=12&rft.issue=7&rft.spage=55&rft.pages=55-&rft.issn=1065-0555&rft_id=info:doi/&rft_dat=%3Cproquest%3E27943851%3C/proquest%3E%3Cgrp_id%3Ecdi_FETCH-proquest_miscellaneous_279438513%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=27943851&rft_id=info:pmid/&rfr_iscdi=true