Liquid‐Superspreading‐Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling

Enhanced boiling heat transfer via surface engineering is a topic of general interest for its great demand in industrial fields. However, as a dynamic interfacial phenomenon, a deep understanding of its process and mechanism, including liquid re‐wetting and vapor departure, is still challenging. Her...

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Bibliographic Details
Published in:Advanced materials (Weinheim) 2023-06, Vol.35 (26), p.e2210557-n/a
Main Authors: Xu, Zhe, Zhang, Peng, Yu, Chuanghui, Miao, Weining, Chang, Qiankun, Qiu, Ming, Li, Yulong, Tian, Ye, Jiang, Lei
Format: Article
Language:English
Subjects:
Boiling
Bubbles
Central processing units
Cooling
CPUs
dynamic re‐wetting
Flat surfaces
Heat exchange
Heat flux
Heat transfer
jet‐flow boiling
Latent heat
liquid superspreading
Materials science
micro‐/nanostructures
Nucleation
phase‐change cooling
Pyramids
Vapors
Wetting
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Summary:Enhanced boiling heat transfer via surface engineering is a topic of general interest for its great demand in industrial fields. However, as a dynamic interfacial phenomenon, a deep understanding of its process and mechanism, including liquid re‐wetting and vapor departure, is still challenging. Herein, a micro‐/nanostructured Cu surface containing a periodic microgroove/pyramid array with rich nanowrinkles is designed, where superspreading (
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.202210557