Active thermal control of power electronic modules

Active thermal control techniques make it feasible to regulate the steady state and transient thermal-mechanical stress in power electronic modules for applications such as motor drives. Online junction temperature estimation and manipulation of the switching frequency and current limit to regulate...

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Bibliographic Details
Published in:IEEE transactions on industry applications 2006-03, Vol.42 (2), p.552-558
Main Authors: Murdock, D.A., Torres, J.E.R., Connors, J.J., Lorenz, R.D.
Format: Article
Language:English
Subjects:
Active control
Active thermal control
Electronic modules
Frequency estimation
Insulated gate bipolar transistors
loss control
Modules
Motor drives
Motors
Multichip modules
On-line systems
operation in limits
power cycle control
Power electronics
reliability control
Steady state
Strategy
Stress control
Switching frequency
Temperature
Thermal stresses
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Summary:Active thermal control techniques make it feasible to regulate the steady state and transient thermal-mechanical stress in power electronic modules for applications such as motor drives. Online junction temperature estimation and manipulation of the switching frequency and current limit to regulate the losses are used to prevent overtemperature and power cycling failures in insulated gate bipolar transistor (IGBT) power modules. The techniques developed in this work are used to actively control the junction temperature of the power module. This control strategy improves power module reliability and increases utilization of the silicon thermal capacity by providing sustained operation at maximum attainable performance limits.
ISSN:0093-9994
1939-9367
DOI:10.1109/TIA.2005.863905