Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology

In this paper, we demonstrate the development of advanced three-dimensional (3-D) low-temperature co-fired ceramic (LTCC) system-on-package (SOP) passive components for compact low-cost millimeter-wave wireless front-end modules. Numerous miniaturized easy-to-design passive circuits that can be used...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2005-06, Vol.53 (6), p.2220-2229
Main Authors: Jong-Hoon Lee, DeJean, G., Sarkar, S., Pinel, S., Kyutae Lim, Papapolymerou, J., Laskar, J., Tentzeris, M.M.
Format: Article
Language:English
Subjects:
Applied sciences
Band pass filters
Ceramics
Channels
Circuit properties
Coupling circuits
Design
Directional filter
dual polarization
duplexer
Duplexers
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Insertion loss
Integrated circuit technology
Joining
low-temperature co-fired ceramic (LTCC)
microstrip antenna
Microstrip antennas
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
millimeter wave
Millimeter wave integrated circuits
Millimeter wave technology
Mixers
Modules
multiplexing
Noise levels
Passive circuits
Passive components
patch resonator
Resonator filters
Resonators
system-on-package (SOP)
three-dimensional (3-D)/vertical integration
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Summary:In this paper, we demonstrate the development of advanced three-dimensional (3-D) low-temperature co-fired ceramic (LTCC) system-on-package (SOP) passive components for compact low-cost millimeter-wave wireless front-end modules. Numerous miniaturized easy-to-design passive circuits that can be used as critical building blocks for millimeter-wave SOP modules have hereby been realized with high-performance and high-integration potential. One miniaturized slotted-patch resonator has been designed by the optimal use of vertical coupling mechanism and transverse cuts and has been utilized to realize compact duplexers (39.8/59 GHz) and three- and five-pole bandpass filters by the novel 3-D (vertical and parallel) deployment of single-mode patch resonators. Measured results agree very well with the simulated data. One multiplexing filter, called the directional channel-separation filter, that can also be used in mixer applications shows insertion loss of
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2005.848777