Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink

Power dissipation in microprocessors will reach a level that necessitates chip-level liquid cooling in the near future. An on-chip microfluidic heat sink can reduce the thermal interfaces between an IC chip and the convective cooling medium. Through wafer-level processing, integrated thermal-fluidic...

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Bibliographic Details
Published in:IEEE electron device letters 2006-02, Vol.27 (2), p.117-119
Main Authors: Dang, B., Bakir, M.S., Meindl, J.D.
Format: Article
Language:English
Subjects:
Applied sciences
Chips
Cooling
Design. Technologies. Operation analysis. Testing
Electronics
Etching
Exact sciences and technology
Fluidics
Heat sinks
Heat transfer
Integrated circuits
Integrated circuits by function (including memories and processors)
Interconnection
Liquid cooling
Microchannel
Microchannels
Microfluidic heatsink
Microfluidics
Microprocessors
Packaging
Polymers
Resistance heating
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Thermal resistance
thermal-fluidic input/output (I/O) interconnects
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Summary:Power dissipation in microprocessors will reach a level that necessitates chip-level liquid cooling in the near future. An on-chip microfluidic heat sink can reduce the thermal interfaces between an IC chip and the convective cooling medium. Through wafer-level processing, integrated thermal-fluidic I/O interconnects enable on-chip microfluidic heat sinks with ultrasmall form factor at low-cost. This letter describes wafer-level integration of microchannels at the wafer back-side with through-wafer fluidic paths and thermal-fluidic input/output interconnection for future generation gigascale integrated chips.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2005.862693