On the electromagnetic radiation of printed-circuit-board interconnections

Large ground and supply layers on interconnected boards represent a radiating antenna structure which may be efficiently excited at its resonances by small high-frequency potential differences. Such potential differences between the boards mainly originate from the inevitable inductive impedance of...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2005-05, Vol.47 (2), p.219-226
Main Authors: Leone, M., Navratil, V.
Format: Article
Language:English
Subjects:
Antenna radiation patterns
Applied sciences
Backplane
connectors
daughterboard
Electromagnetic compatibility
Electromagnetic interference
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Equivalent circuits
Exact sciences and technology
ground pins
Information, signal and communications theory
Microstrip antennas
motherboard
Printed circuits
Receiving antennas
SPICE
subboard
Telecommunications and information theory
Transfer functions
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Description
Summary:Large ground and supply layers on interconnected boards represent a radiating antenna structure which may be efficiently excited at its resonances by small high-frequency potential differences. Such potential differences between the boards mainly originate from the inevitable inductive impedance of the signal-current return path in the connector, usually provided by ground pins. The presented modeling approach is based on an antenna transfer function for the global interconnecting structure and a partial-inductance equivalent circuit for the connector. As shown by the example of a motherboard-daughterboard structure, the model enables a systematic study of the radiation mechanism, depending on signal/ground-pin configuration, as well as geometrical and electrical parameters. In conjunction with SPICE simulations of the connector equivalent circuit, the signal driver and receiver dynamic characteristic can also be properly included. Validation is provided by full-wave simulation and measurement results.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2005.847400