Loading…

Corrections to "200-mm Wafer Scale Transfer of 0.18mum Dual-Damascene Cu/SiO_2Interconnection System to Plastic Substrates"

Saved in:
Bibliographic Details
Published in:IEEE electron device letters 2006-03, Vol.27 (3), p.198-198
Main Authors: Teh, W H, Lihui, G, Kumar, R, Kwong, D-L
Format: Article
Language:English
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0741-3106
DOI:10.1109/LED.2006.870843