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Corrections to "200-mm Wafer Scale Transfer of 0.18mum Dual-Damascene Cu/SiO_2Interconnection System to Plastic Substrates"
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Published in: | IEEE electron device letters 2006-03, Vol.27 (3), p.198-198 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Online Access: | Get full text |
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Summary: | |
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ISSN: | 0741-3106 |
DOI: | 10.1109/LED.2006.870843 |