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Grayscale-patterned integrated multilayer-metal-dielectric microcavities for on-chip multi/hyperspectral imaging in the extended visible bandwidth
Pixelated filter arrays of Fabry-Perot (FP) cavities are widely integrated with photodetectors to achieve a WYSIWYG ("what you see is what you get") on-chip spectral measurements. However, FP-filter-based spectral sensors typically have a trade-off between their spectral resolution and wor...
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Published in: | Optics express 2023-04, Vol.31 (9), p.14027-14036 |
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container_end_page | 14036 |
container_issue | 9 |
container_start_page | 14027 |
container_title | Optics express |
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creator | Zhu, Jingyuan Zhou, Siliang Ning, Yi Dun, Xiong Dong, Siyu Wang, Zhanshan Cheng, Xinbin |
description | Pixelated filter arrays of Fabry-Perot (FP) cavities are widely integrated with photodetectors to achieve a WYSIWYG ("what you see is what you get") on-chip spectral measurements. However, FP-filter-based spectral sensors typically have a trade-off between their spectral resolution and working bandwidth due to design limitations of conventional metal or dielectric multilayer microcavities. Here, we propose a new idea of integrated color filter arrays (CFAs) consisting of multilayer metal-dielectric-mirror FP microcavities that, enable a hyperspectral resolution over an extended visible bandwidth (∼300 nm). By introducing another two dielectric layers on the metallic film, the broadband reflectance of the FP-cavity mirror was greatly enhanced, accompanied by as-flat-as-possible reflection-phase dispersion. This resulted in balanced spectral resolution (∼10 nm) and spectral bandwidth from 450 nm to 750 nm. In the experiment, we used a one-step rapid manufacturing process by using grayscale e-beam lithography. A 16-channel (4 × 4) CFA was fabricated and demonstrated on-chip spectral imaging with a CMOS sensor and an impressive identification capability. Our results provide an attractive method for developing high-performance spectral sensors and have potential commercial applications by extending the utility of low-cost manufacturing process. |
doi_str_mv | 10.1364/OE.485869 |
format | article |
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title | Grayscale-patterned integrated multilayer-metal-dielectric microcavities for on-chip multi/hyperspectral imaging in the extended visible bandwidth |
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