Deformation twinning in polycrystalline copper at room temperature and low strain rate

Deformation twins were widely observed in polycrystalline Cu with grain sizes varying from micrometers to nanometers during the process of equal channel angular pressing at room temperature and low strain rate (∼10 −2 s −1). The microstructures of deformation twins were characterized by a transmissi...

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Bibliographic Details
Published in:Acta materialia 2006-02, Vol.54 (3), p.655-665
Main Authors: Huang, C.X., Wang, K., Wu, S.D., Zhang, Z.F., Li, G.Y., Li, S.X.
Format: Article
Language:English
Subjects:
Applied sciences
Deformation twinning
Equal channel angular pressing
Exact sciences and technology
Metals. Metallurgy
Nanostructured material
Shear band
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Summary:Deformation twins were widely observed in polycrystalline Cu with grain sizes varying from micrometers to nanometers during the process of equal channel angular pressing at room temperature and low strain rate (∼10 −2 s −1). The microstructures of deformation twins were characterized by a transmission electron microscope (TEM) and a high-resolution TEM. It was found that deformation twinning in coarse-grained Cu occurred mainly in shear bands and their intersections as a result of the very high local stress resulted from the severe plastic deformation, and followed the well known pole mechanism. With a decrease in the grain size down to submicrometer (
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2005.10.002