Micro via filling plating technology for IC substrate applications

The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporate high density interconnection technology (such as build-up and semi-additive processes). Micro stacked via is one technology utilized to produce high-dens...

Full description

Saved in:
Bibliographic Details
Published in:Circuit world 2004-09, Vol.30 (3), p.26-32
Main Authors: Yeh, Cheng-Ching, Lan, Kuo-Hsing, Dow, Wei-Ping, Hsu, Jui-Hsia, Lee, Cliff, Hsu, Chih-Hao, Lee, Ken, Chen, Jordan, Lu, Philip
Format: Article
Language:English
Subjects:
Acids
Additives
By products
Copper
Design of experiments
Interest rates-deposits
Microelectronics
Plating
Printed circuit boards
Printedcircuit boards
Studies
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporate high density interconnection technology (such as build-up and semi-additive processes). Micro stacked via is one technology utilized to produce high-density structures. Dielectric resin, conductive paste or via plating are usually applied for the filling process. As compared with other filling methods, via filling plating technology has advantages in offering a shorter process and higher reliability. This paper discusses the influence of different equipment design, operating conditions and additives on via filling plating technology.
ISSN:0305-6120
1758-602X
0305-6120
DOI:10.1108/03056120410520588